@divine251b: Huawei just broke Moore's Law with 'logic folding,' stacking chips 3D to boost density by 53%. Old tech is obsolete. #Tech #Huawei #Innovation #Moore'sLaw #Semiconductors
Sorry I’m still stuck on how the US made the dutch government block a company from selling to another company. That shouldn’t be a thing.
2026-06-14 13:01:28
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KGAKZIERO🇿🇦 :
When there is breakthrough in America you don't often hear the word "claim" and but this guy is using that word
2026-06-14 07:12:51
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Herman Figueroa :
why none is saying that when a big company announces this kind of hit, it means they are 10 steps ahead, and they are launching some commercial and relatively stable products for home users to buy it
2026-06-14 23:08:30
3
The G Man :
If that's not the peak of human engineering. "Oh hey we're going to block access to key components to mess with your business." "Fine we'll completely revolutionise the process and outdo your original." Brilliant.
2026-06-13 08:06:02
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Ismails77 :
Every single time the US takes a measure to make a competitor fail, it makes that competitor more resourceful and independent of the US trade network.
2026-06-13 02:08:49
572
caspervanzylv3 :
Moore's Law is by no means fundamental or something that can be broken. It is a misnomer. It is simply an observation about the pace of technological advancement. It has some predictive value, but it is not a fundamental feature of anything. Any big breakthrough in technology could 'violate' it
2026-06-14 09:29:18
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Sonam :
That's why they say necessity is mother of invention.
2026-06-12 14:27:05
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wendyinfutures :
And it’s innovations like these that will render all these giant data centres stranded assets before they’re finished building.
2026-06-13 09:46:14
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Ryza_Altair :
I know nobody is going to believe this, but I was wondering about the same thing 10 years ago. If transistors can't be made any smaller and the base area can't be made any larger, then why not stack them vertically?
I asked my professor, and his answer was that heat would be a major problem, communication between layers would introduce delays, and the wafer manufacturing technology at the time could only produce a single layer.
2026-06-14 17:47:42
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M 🍉🇺🇳 :
the problem is heat, I wonder how they did it.
2026-06-14 07:51:53
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yanladonne :
Gg, you made your competitors search for solutions outside the box and they actually found solutions outside the box
2026-06-14 06:47:51
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Daniel Dias :
well, the move was actually good for the industry, forcing Huawei to invest in development.
competition is always good for consumers
2026-06-12 14:20:08
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Dodoco :
hardships & necessity is the mother of innovation & invention
2026-06-14 11:30:47
5
Matt :
"free market capitalism"
2026-06-14 08:44:34
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connorthescot :
And none of us will see the benefits because the US pressured our governments to ban huawei entirely…
2026-06-13 07:56:27
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dazadymgzv4 :
Necessity is the mother of invention.
2026-06-14 07:58:50
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TSmith1134 :
dont other companies already do this?
2026-06-14 15:51:40
2
Raytrace :
thank you for not saying 'compute'
2026-06-14 09:12:32
1
reena :
I’m learning Mandarin.
2026-06-12 16:51:49
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Tim E83 :
lol, they are well ahead of everyone else, they'll find a way. I had one of their phones about 6 years ago and it was miles ahead of anything else back then, still runs great now for my mum
2026-06-13 01:19:13
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@leahcimthewright :
But at what cost lol
2026-06-14 18:57:56
5
Hilmi Noh :
this is not new actually. I did my internship on this 3DIC back in 2013 for 6 months.... the main problem for this 3DIC is heat... the heat accumulated in the middle stack is hard to be extracted out... cooling system is still the challenge for this 3DIC... hence, why people are still doing r&d on microchannel cooling system... trying to put those channel in between the 3DIC
2026-06-14 16:06:46
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Pesky :
so the same as AMD's X3D? but don't get me wrong this is a great thing
2026-06-13 09:19:47
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The_Wavey_Davey :
Isn't cooling then a problem?
2026-06-12 23:09:37
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David Harrison :
Export controls just kills innovation
2026-06-13 06:56:23
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